IEEE - Institute of Electrical and Electronics Engineers, Inc. - New diallyl phthalate resins for low pressure molding encapsulation of electronic components

1969 9th Electrical Insulation Conference

Author(s): N. R. Segro ; H. H. Beacham
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 1969
Conference Location: Boston, MA, USA, USA
Conference Date: 8 September 1969
Page(s): 98 - 100
ISBN (Paper): 978-1-5090-3108-5
DOI: 10.1109/EIC.1969.7461841
Regular:

The allylic resins are well known among thermosets for their excellent electrical characteristics and in particular for their ability to retain these properties under adverse environmental... View More

Advertisement