IEEE - Institute of Electrical and Electronics Engineers, Inc. - Polyimide-mica composite materials for extreme condition applications

1969 9th Electrical Insulation Conference

Author(s): J. L. McDonald
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 1969
Conference Location: Boston, MA, USA, USA
Conference Date: 8 September 1969
Page(s): 88 - 91
ISBN (Paper): 978-1-5090-3108-5
DOI: 10.1109/EIC.1969.7461837
Regular:

Electrical insulation requirements have been raised considerably over the past few years as applications have been developed that feature extreme conditions which could not be handled by older... View More

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