IEEE - Institute of Electrical and Electronics Engineers, Inc. - Inorganic bonded mica for high temperature applications

1967 Seventh Electrical Insulation Conference

Author(s): William R. Mansfield ; Allen N. Towne
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 1967
Conference Location: Chicago, IL, USA, USA
Conference Date: 15 October 1967
Page(s): 299 - 301
ISBN (Paper): 978-1-5090-3106-1
DOI: 10.1109/EIC.1967.7468833
Regular:

One of the problems of developing new insulations to fill specific applications is to determine what properties are meaningful and required to really fill the need.

Advertisement