IEEE - Institute of Electrical and Electronics Engineers, Inc. - "Solder ball" formation in silicon alloy transistors

Author(s): E.B. Hakim ; L.K. McSherry ; B. Reich
Sponsor(s): IEEE Publication
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 1965
Volume: 53
Page(s): 389
ISSN (Paper): 0018-9219
ISSN (Online): 1558-2256
DOI: 10.1109/PROC.1965.3754
Regular:

The authors have found that formation of "solder balls" may not be due to any foreign matter in the package but instead be a characteristic of this type of device when: a) Local hot spots develop... View More

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