IEEE - Institute of Electrical and Electronics Engineers, Inc. - Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration

Author(s): Rui Li ; Cheng Jin ; Siong Chiew Ong ; Teck Guan Lim ; Ka Fai Chang ; Soon Wee Ho
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2013
Volume: 3
Page Count: 8
Page(s): 1,481 - 1,488
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2236385
Regular:

In this paper, a 77-GHz automotive radar sensor transceiver front-end module is packaged with a novel embedded wafer level packaging (EMWLP) technology. The bare transceiver die and the... View More

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