IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Multiscale Assembly and Packaging System for Manufacturing of Complex Micro-Nano Devices

Author(s): A. N. Das ; R. Murthy ; D. O. Popa ; H. E. Stephanou
Sponsor(s): IEEE Robotics and Automation Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2012
Volume: 9
Page Count: 11
Page(s): 160 - 170
ISSN (Paper): 1545-5955
ISSN (Online): 1558-3783
DOI: 10.1109/TASE.2011.2173570
Regular:

Reliable manufacturability has always been a major issue in commercialization of complex and heterogeneous microsystems. Though successful for simpler and monolithic microdevices such as... View More

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