IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison of the Thermal Performance of the Multichip LED Packages

Author(s): Byung-Ho Kim ; Cheol-Hee Moon
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2012
Volume: 2
Page Count: 6
Page(s): 1,832 - 1,837
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2200483
Regular:

Single chip, 4-chip, and 16-chip light emitting diode (LED) packages were prepared to compare the thermal performance of the LED packages. Vertical type, GaN blue LED chips with alumina submount... View More

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