IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design of Simultaneous Bi-Directional Transceivers Utilizing Capacitive Coupling for 3DICs in Face-to-Face Configuration

Author(s): Myat Thu Linn Aung ; E. Lim ; T. Yoshikawa ; T. T. Kim
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2012
Volume: 2
Page Count: 9
Page(s): 257 - 265
ISSN (Paper): 2156-3357
ISSN (Online): 2156-3365
DOI: 10.1109/JETCAS.2012.2193839
Regular:

Capacitive-coupling-based simultaneously bi-directional transceivers for chip-to-chip communication in three-dimensional integrated circuits are presented. By employing a 4-level signaling... View More

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