IEEE - Institute of Electrical and Electronics Engineers, Inc. - Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests

Author(s): Teng Wang ; Si Chen ; Di Jiang ; Yifeng Fu ; K. Jeppson ; Lilei Ye ; Johan Liu
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2012
Volume: 33
Page Count: 3
Page(s): 420 - 422
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/LED.2011.2177804
Regular:

Through-silicon vias (TSVs) filled with densified and transferred carbon nanotube (CNT) forests are experimentally demonstrated. The filling is achieved by a postgrowth low-temperature transfer... View More

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