IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigation of the Packaging-Induced RF Attenuations and Resonances in a Broadband Optoelectronic Modulator Module

Author(s): Wei Han ; M. Rensing ; Xin Wang ; Hua Yang ; F. H. Peters ; P. O'Brien
Sponsor(s): IEEE Lasers and Electro-Optics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2012
Volume: 30
Page Count: 8
Page(s): 2,610 - 2,617
ISSN (Paper): 0733-8724
ISSN (Online): 1558-2213
DOI: 10.1109/JLT.2012.2204727
Regular:

In this paper, the influence of packaging-induced RF signal degradation on an optoelectronic modulator module is investigated. A directly modulated laser (DML) is modeled and packaged in a... View More

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