IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Fuzzy Method for Global Quality Index Evaluation of Solder Joints in Surface Mount Technology

Author(s): Giuseppe Acciani ; Girolamo Fornarelli ; Antonio Giaquinto
Sponsor(s): IEEE Industrial Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2011
Volume: 7
Page Count: 10
Page(s): 115 - 124
ISSN (Paper): 1551-3203
ISSN (Online): 1941-0050
DOI: 10.1109/TII.2010.2076292
Regular:

In recent years, the requirement of compact devices caused an increasing use of Surface Mount Technology. This technology guarantees the reduction of the size of electronic packages by exploiting... View More

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