IEEE - Institute of Electrical and Electronics Engineers, Inc. - On-Chip Integration of Acceleration, Pressure, and Temperature Composite Sensor With a Single-Sided Micromachining Technique

Author(s): Quan Wang ; Xinxin Li ; Tie Li ; Minhang Bao ; Wei Zhou
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2011
Volume: 20
Page Count: 11
Page(s): 42 - 52
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/JMEMS.2010.2100031
Regular:

Abstract-This paper presents a novel composite sensor that is monolithically integrated with an accelerometer, a pressure sensor, and a thermometer by using a single-side-processed... View More

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