IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of Tin Deposition Methods on Tin Whisker Formation

Author(s): L. A. Pinol ; J. Melngailis ; H. K. Charles ; D. M. Lee ; R. Deacon ; G. Coles ; G. Clatterbaugh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2011
Volume: 1
Page Count: 5
Page(s): 2,028 - 2,032
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2167338
Regular:

The effect of pure tin deposition method on the propensity to form tin whiskers was studied over the course of one year. Deposition methods employed include matte and bright electroplating,... View More

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