IEEE - Institute of Electrical and Electronics Engineers, Inc. - Efficient Approximation Algorithms for Chemical Mechanical Polishing Dummy Fill

Author(s): Chunyang Feng ; Hai Zhou ; Changhao Yan ; Jun Tao ; Xuan Zeng
Sponsor(s): IEEE Council on Electronic Design Automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2011
Volume: 30
Page Count: 14
Page(s): 402 - 415
ISSN (Paper): 0278-0070
ISSN (Online): 1937-4151
DOI: 10.1109/TCAD.2010.2088030
Regular:

To reduce chip-scale topography variation in chemical mechanical polishing process, dummy fill is widely used to improve the layout density uniformity. Previous researches formulated the... View More

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