IEEE - Institute of Electrical and Electronics Engineers, Inc. - Comparison of the Surface Modification of Tungsten and Gold by Methane Plasma Source Ion Implantation

Author(s): R. Hatada ; S. Flege ; W. Ensinger ; K. Baba
Sponsor(s): IEEE Nuclear and Plasma Sciences Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2011
Volume: 39
Page Count: 5
Page(s): 3,080 - 3,084
ISSN (Paper): 0093-3813
ISSN (Online): 1939-9375
DOI: 10.1109/TPS.2011.2160462
Regular:

On the basis of two substrate materials which possess similar atomic mass but different physical and chemical properties (e.g., sputtering yield and susceptibility for carbide formation), the... View More

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