IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Cu-Plate-Bonded System-in-Package (SiP) With Low Spreading Resistance of Topside Electrodes for Voltage Regulators

Author(s): Takayuki Hashimoto ; Tomoaki Uno ; Masaki Shiraishi ; Tetsuya Kawashima ; Noboru Akiyama ; Nobuyoshi Matsuura ; Hirofumi Akagi
Sponsor(s): IEEE Power Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2010
Volume: 25
Page Count: 10
Page(s): 2,310 - 2,319
ISSN (Paper): 0885-8993
ISSN (Online): 1941-0107
DOI: 10.1109/TPEL.2010.2047271
Regular:

This paper presents a system-in-package (SiP) with Cu-plate bonding for voltage regulators. The SiP reduces the power loss by 23% and the thermal resistance by 44% compared to those of a SiP with... View More

Advertisement