IEEE - Institute of Electrical and Electronics Engineers, Inc. - Tin Whisker Nucleation and Growth on Sn-Pb Eutectic Coating Layer Inside Plated Through Holes With Press-Fit Pins

Author(s): J. Liang ; N. Dariavach ; D. Shangguan
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2008
Volume: 31
Page Count: 7
Page(s): 152 - 158
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2008.916811
Regular:

It has been long believed that residual stress is the root cause for tin whisker formation on pure tin-plated component leads. However, tin whisker formation could be observed on the surface of... View More

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