IEEE - Institute of Electrical and Electronics Engineers, Inc. - Brittle to Ductile Fracture Transition in Bulk Pb-Free Solders

Author(s): P. Ratchev ; B. Vandevelde ; B. Verlinden ; B. Allaert ; D. Werkhoven
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2007
Volume: 30
Page Count: 8
Page(s): 416 - 423
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2007.901744
Regular:

The fracture toughness of bulk Sn, Sn-Cu, Sn-Ag, and Sn-Ag-Cu lead-free solders was measured as function of the temperature by means of a pendulum impact test (Charpy test). A ductile to brittle... View More

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