IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of (Au, Ni)Sn $_{4}$ Evolution on Sn-37Pb/ENIG Solder Joint Reliability Under Isothermal and Temperature-Cycled Conditions

Author(s): J.A. Davis ; M.J. Bozack ; J.L. Evans
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2007
Volume: 30
Page Count: 10
Page(s): 32 - 41
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2007.892065
Regular:

The ternary intermetallic compound Au0.5Ni0.5Sn4 forms at the Sn-37Pb/ENIG solder interface during aging and temperature cycling, leading to increased interfacial... View More

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