IEEE - Institute of Electrical and Electronics Engineers, Inc. - Length Distribution Analysis for Tin Whisker Growth

Author(s): Y. Fukuda ; M. Osterman ; M. Pecht
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2007
Volume: 30
Page Count: 5
Page(s): 36 - 40
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/TEPM.2006.890638
Regular:

The global movement to lead-free electronics has led semiconductor device assemblers to switch terminals and finishes from lead-based to pure tin or high tin lead-free alloys. This transition has... View More

Advertisement