IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stress-Induced Tin Whisker Initiation Under Contact Loading

Author(s): T. Shibutani ; Qiang Yu ; T. Yamashita ; M. Shiratori
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2006
Volume: 29
Page Count: 6
Page(s): 259 - 264
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/TEPM.2006.887357
Regular:

As electronic components become smaller, tin whiskers have an increasingly adverse effect on the assessment of the reliability of the components. In particular, the contact between components... View More

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