IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ruthenium and tungsten as contact materials in hermetically plastic sealed telecom- and signal-relays

Author(s): W. Johler
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2004
Volume: 27
Page(s): 19 - 29
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2004.825780
Regular:

Palladium is the most frequently used contact material for telecommunication and signal relays. Good contact resistance stability and material transfer characteristics make it the most often used.... View More

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