IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study of temperature dependence of bump bonding for the BTeV pixel detector

Author(s): M. Turqueti ; S. Cihangir ; S. Kwan ; J.A. Appel ; G. Cardoso ; D.C. Christian ; B.K. Hall ; S. Zimmermann
Sponsor(s): IEEE Nuclear and Plasma Sciences Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2004
Volume: 51
Page(s): 2,161 - 2,167
ISSN (Paper): 0018-9499
ISSN (Online): 1558-1578
DOI: 10.1109/TNS.2004.834709
Regular:

The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the... View More

Advertisement