IEEE - Institute of Electrical and Electronics Engineers, Inc. - Silicon micromachined hollow microneedles for transdermal liquid transport

Author(s): H.J.G.E. Gardeniers ; R. Luttge ; E.J.W. Berenschot ; M.J. de Boer ; S.Y. Yeshurun ; M. Hefetz ; R. van't Oever ; A. van den Berg
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2003
Volume: 12
Page Count: 8
Page(s): 855 - 862
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/JMEMS.2003.820293
Regular:

This paper presents a novel process for the fabrication of out-of-plane hollow microneedles in silicon. The fabrication method consists of a sequence of deep-reactive ion etching (DRIE),... View More

Advertisement