IEEE - Institute of Electrical and Electronics Engineers, Inc. - An effective methodology for thermal characterization of electronic packaging

Author(s): Wen-Hwa Chen ; Hsien-Chie Cheng ; Hsin-An Shen
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2003
Volume: 26
Page Count: 11
Page(s): 222 - 232
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2002.806180
Regular:

An effective and novel methodology that integrates infrared (IR) thermography measurement and a three-dimensional (3-D) finite element (FE) model is proposed for thermal characterization of... View More

Advertisement