IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]

Author(s): Shyang-Jye Chang ; Sheng-Jye Hwang
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2003
Volume: 26
Page Count: 1
Page(s): 264
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/TEPM.2003.823165
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