IEEE - Institute of Electrical and Electronics Engineers, Inc. - Rf measurements of die and packages

Author(s): A. Riddle
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2002
Volume: 3
Page Count: 2
Page(s): 76 - 77
ISSN (Paper): 1527-3342
DOI: 10.1109/MMW.2002.1145679
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