IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advanced process characterization for 125 kHz wire bonder ultrasonic transducers

Author(s): L. Parrini
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2002
Volume: 25
Page Count: 9
Page(s): 486 - 494
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/TCAPT.2002.803658
Regular:

A high frequency ultrasonic transducer for wire bonding is conceived, designed, prototyped, tested and industrially produced. The influence of each feature of the ultrasonic transducer design,... View More

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