IEEE - Institute of Electrical and Electronics Engineers, Inc. - Cylindrical pin-fin fan-sink heat transfer and pressure drop correlations

Author(s): Ning Zheng ; R.A. Wirtz
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2002
Volume: 25
Page Count: 8
Page(s): 15 - 22
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.991170
Regular:

New pressure drop/flow rate measurements coupled with a previously reported heat transfer database have resulted in new friction factor and heat transfer correlation equations for fan-driven... View More

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