IEEE - Institute of Electrical and Electronics Engineers, Inc. - Manufacturing and packaging of sensors for their integration in a vertical MCM microsystem for biomedical applications

Author(s): A. Gotz ; I. Gracia ; C. Cane ; A. Morrissey ; J. Alderman
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2001
Volume: 10
Page Count: 11
Page(s): 569 - 579
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/84.967380
Regular:

Demonstrates the feasibility of integrating fragile micromachined chips into a complex three-dimensional (3-D) multichip module (MCM) microsystem for a biomedical application. The system is based... View More

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