IEEE Computer Society - Thermal Modeling and Validation of a Real-World Mobile AP

Author(s): Young-Ho Gong ; Jae Jeong Yoo ; Sung Woo Chung
Publisher: IEEE Computer Society
Publication Date: 1 February 2018
Volume: 35
Page(s): 55 - 62
ISSN (Electronic): 2168-2364
ISSN (Paper): 2168-2356
DOI: 10.1109/MDAT.2017.2695958
Regular:

Thermal issues are plaguing high-performance systems because of their high power consumption, and mobile systems because of their form factor and compactness. Researchers have developed tools and... View More

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