European Microwave Association - Scanning microwave microscopy of aluminum CMOS interconnect lines buried in oxide and water

2017 47th European Microwave Conference (EuMC)

Author(s): Xin Jin ; Kuanchen Xiong ; Roderick Marstell ; Nicholas C. Strandwitz ; James C. M. Hwang ; Marco Farina ; Alexander Goritz ; Matthias Wietstruck ; Mehmet Kaynak
Publisher: European Microwave Association
Publication Date: 1 October 2017
Conference Location: Nuremberg, Germany
Conference Date: 10 October 2017
Page(s): 975 - 977
ISBN (Electronic): 978-2-87487-047-7
ISBN (USB): 978-2-87487-047-7
DOI: 10.23919/EuMC.2017.8231009
Regular:

Using a scanning microwave microscope, we imaged in water aluminum interconnect lines buried in aluminum and silicon oxides fabricated through a state-of-the-art SiGe BiCMOS process. The results... View More

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