IEEE - Institute of Electrical and Electronics Engineers, Inc. - A study on /spl Rfr//sup m//spl rarr//spl Rfr//sup 1/ maps: application to a 0.16-/spl mu/m via etch process endpoint

Author(s): E.A. Rietman ; N. Layadi
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2000
Volume: 13
Page Count: 12
Page(s): 457 - 468
ISSN (Paper): 0894-6507
ISSN (Online): 1558-2345
DOI: 10.1109/66.892632
Regular:

We introduce several endpoint algorithms that map real-time, in situ process signals to a via etch process endpoint. Some of the mathematical techniques include: Andrews plots (Fourier series),... View More

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