IEEE - Institute of Electrical and Electronics Engineers, Inc. - Steady state thermal characterization and junction temperature estimation of multichip module packages using the response surface method

Author(s): B.A. Zahn
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2000
Volume: 23
Page Count: 7
Page(s): 33 - 39
ISSN (Paper): 1521-3331
ISSN (Online): 1557-9972
DOI: 10.1109/6144.833039
Regular:

The steady state thermal performance of semiconductor packages has been traditionally reported through the utilization of a single junction-to-ambient thermal resistance constant commonly referred... View More

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