IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal characteristics of submicron vias studied by scanning Joule expansion microscopy

Author(s): M. Igeta ; K. Banerjee ; Guanghua Wu ; Chenming Hu ; A. Majumdar
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2000
Volume: 21
Page Count: 3
Page(s): 224 - 226
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/55.841303
Regular:

Thermal characteristics of submicron vias strongly impact reliability of multilevel VLSI interconnects. The magnitude and spatial distribution of the temperature rise around a via are important to... View More

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