IEEE - Institute of Electrical and Electronics Engineers, Inc. - Mechanisms underlying the unstable contact resistance of conductive adhesives

Author(s): Daoqiang Lu ; Q.K. Tong ; C.P. Wong
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 1999
Volume: 22
Page Count: 5
Page(s): 228 - 232
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.795858
Regular:

One critical obstacle of current conductive adhesives is their unstable contact resistance with nonnoble metal finished components during high temperature and humidity aging. It is commonly... View More

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