IEEE - Institute of Electrical and Electronics Engineers, Inc. - Plating of small blind vias [multilayer PCBs]

Author(s): Show-Chin Kou ; Aina Hung
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 1999
Volume: 22
Page Count: 7
Page(s): 202 - 208
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.795855
Regular:

Metallization of laminates with blind vias on the dielectric side was performed by electroless copper plating with subsequent copper electroplating. The vertical cross section of blind vias with... View More

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