IEEE - Institute of Electrical and Electronics Engineers, Inc. - A model for optimizing the assembly and disassembly of electronic systems

Author(s): P.A. Sandborn ; C.F. Murphy
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 1999
Volume: 22
Page Count: 13
Page(s): 105 - 117
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.778170
Regular:

This paper presents a methodology that incorporates simultaneous consideration of economic and environmental merit during the virtual prototyping phase of electronic product design. A model that... View More

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