IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermosonic gold wire bonding to laminate substrates with palladium surface finishes

Author(s): R.W. Johnson ; M.J. Palmer ; M.J. Bozack ; T. Isaacs-Smith
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Volume: 22
Page Count: 9
Page(s): 7 - 15
ISSN (Paper): 1521-334X
ISSN (Online): 1558-0822
DOI: 10.1109/6104.755084
Regular:

As the laminate substrate industry moves from hot air solder level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium,... View More

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