IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design and characteristics of a newly developed cavity-up plastic and ceramic laminated thin BGA package

Author(s): H. Asai ; K. Yano ; K. Iyogi ; N. Iwase ; T. Fujiwara
Sponsor(s): IEEE Components, Packaging, and Manufacturing Technology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 1999
Volume: 22
Page Count: 8
Page(s): 460 - 467
ISSN (Paper): 1521-3323
ISSN (Online): 1557-9980
DOI: 10.1109/6040.784500
Regular:

The key requirements for a package are high electric and thermal performance, thinness, light weight, small size or high assembly density, and low cost. Plastic packages are superior in terms of... View More

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