IEEE - Institute of Electrical and Electronics Engineers, Inc. - Charge deposition modeling of thermal neutron products in fast submicron MOS devices

Author(s): X.W. Zhu ; L.W. Massengill ; C.R. Cirba ; H.J. Barnaby
Sponsor(s): IEEE Nuclear and Plasma Sciences Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 1999
Volume: 46
Page Count: 8
Page(s): 1,378 - 1,385
ISSN (Paper): 0018-9499
ISSN (Online): 1558-1578
DOI: 10.1109/23.819096
Regular:

Ground-based thermal neutron reaction products (/spl alpha/, /sup 7/Li) appear to be an important terrestrial SEE concern for modern submicron technologies. We address some interesting spatial and... View More

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