IEEE - Institute of Electrical and Electronics Engineers, Inc. - A modular micromachined high-density connector system for biomedical applications

Author(s): T. Akin ; B. Ziaie ; S.A. Nikles ; K. Najafi
Sponsor(s): IEEE Engineering In Medicine and Biology Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 1999
Volume: 46
Page(s): 471 - 480
ISSN (Electronic): 1558-2531
ISSN (Paper): 0018-9294
DOI: 10.1109/10.752944
Regular:

This paper presents a high-density, modular, low profile, small, and removable connector system developed using micromachining technologies for biomedical applications. This system consists of a... View More

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