IEC - International Electrotechnical Commission - IEC 62137:2004/COR1:2005
Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
replaced
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 27 January 2005 |
| Status: | replaced |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
IEC 62137:2004/COR1:2005
January 27, 2005
Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
A description is not available for this item.
July 6, 2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area...