IEC - International Electrotechnical Commission - IEC 60749-6:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
revised
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 12 August 2003 |
| Status: | revised |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Modification of the validity date: now put at 2007.
Document History
March 3, 2017
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-6:2017 is to test and determine the effect on all solid state electronic devices of storage at elevated temperature without electrical stress applied. This test is typically used to...
IEC 60749-6:2002/COR1:2003
August 12, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Modification of the validity date: now put at 2007.
April 12, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Aims at testing and determining the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is considered non-destructive. The...