IEC - International Electrotechnical Commission - IEC 60749-31:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 August 2003 |
| Status: | published |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Modification of the validity date: now put at 2007.
Document History
IEC 60749-31:2002/COR1:2003
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Modification of the validity date: now put at 2007.
August 30, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads. The contents of...