IEC - International Electrotechnical Commission - IEC 60749-22:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 August 2003 |
| Status: | published |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
IEC 60749-22:2002/COR1:2003
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
A description is not available for this item.
September 12, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the...