IEC - International Electrotechnical Commission - IEC 60749-32:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 August 2003 |
| Status: | published |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
November 29, 2010
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external...
July 28, 2010
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.
IEC 60749-32:2002/COR1:2003
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.
August 30, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to external heating. The test uses a needle flame, simulating the...