IEC - International Electrotechnical Commission - IEC 60749-10:2002/COR1:2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
revised
Buy Now
| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 13 August 2003 |
| Status: | revised |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
abstract:
Modification of the validity date: now put at 2007.
Document History
April 27, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of...
IEC 60749-10:2002/COR1:2003
August 13, 2003
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Modification of the validity date: now put at 2007.
April 9, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied...