IEC - International Electrotechnical Commission - IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 17 July 2013 |
| Status: | published |
| Page Count: | 26 |
| ICS Code (Other semiconductor devices): | 31.080.99 |
abstract:
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This... View More
Document History
IEC 62047-18:2013
July 17, 2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This...