IEC - International Electrotechnical Commission - IEC 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
published
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| Organization: | IEC - International Electrotechnical Commission |
| Publication Date: | 7 May 2013 |
| Status: | published |
| Page Count: | 30 |
| ICS Code (Printed circuits and boards): | 31.180 |
abstract:
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for... View More
Document History
IEC 61189-11:2013
May 7, 2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for...